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TLP848 2007-10-01 1 toshiba photointerrupter in frared led + phototransistor TLP848 camera module for mobile phone digital still camera and video camera personal equipment and sma ll-sized oa equipment the TLP848 is a surface-mount photointerrupter which is composed of a gaas infrared led and a si phototransistor. it is an ultra compact package. moreover it has a wider gap width than 1mm gap width of industry-stand ard and has a high resolution. ? ultra compact package : 2.8 1.9 2.5mm (typ.) ? surface-mount type ? lead(pb)-free ? gap width : 1.2mm (typ.) ? high resolution : slit width 0.3 mm (typ.) ? high current transfer ratio : i c /i f = 3% (min) ? material of the package : pps (polyphenylene sulfide) (ul94v-0) absolute maximum ratings (ta = 25c ) marking (note 2) characteristics symbol rating unit forward current i f 30 ma forward current derating (ta>25c) i f/ c ?0.33 ma/c led reverse voltage v r 5 v collector-emitter voltage v ceo 15 v emitter-collector voltage v eco 5 v collector power dissipation p c 75 mw collector power dissipation derating (ta>25 ) p c/ c ?1 mw/c detector collector current i c 50 ma operating temperature range t opr ? 30 to 85 c storage temperature range t stg ? 40 to 100 c soldering temperature (note 1) t sol 250 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: the reflow time and the example of temperature profile are shown in the sect ion entitled mounting method. note 2: weekly code: (three digits) toshiba 11-3b1 weight: 0.017 g (typ.) weekly code week of manufacture (01 for first week of year, continues up to 52 or 53) year of manufacture (one low-order digits of calendar year)
TLP848 2007-10-01 2 optical and electrical characteristics (ta = 25c) characteristics symbol test conditions min typ. max unit forward voltage v f i f = 10 ma 1.10 1.23 1.40 v reverse current i r v r = 5 v ? ? 10 a led peak emission wavelength p i f = 10 ma ? 940 ? nm dark current i d (i ceo ) v ce = 12 v, i f = 0 ? ? 0.05 a detector peak sensitivity wavelength p ? ? 820 ? nm TLP848 3 ? 24 % current transfer ratio i c /i f v ce = 2 v i f = 5 ma TLP848 (r) 4 ? 20 % collector-emitter saturation voltage v ce (sat) i f = 10 ma, i c = 0.15 ma ? 0.1 0.4 v rise time t r ? 15 50 coupled fall time t f v cc = 5 v, i c = 1 ma r l = 1k (note 3) ? 15 50 s note 3: switching time measurement circuit and waveform v cc v out r l i f v out i f t r 90% 10% t f t d t s
TLP848 2007-10-01 3 package dimensions: toshiba 11-3b1 weight: 0.017 g (typ.) pin connection unit: mm tolerance : 0.1mm unless otherwise specified ( ): reference value gate position center of sensor 1: cathode 2: anode 3: collector 4: emitter 2 1 3 4
TLP848 2007-10-01 4 handling and mounting precautions ? care must be taken in relation to the environment in which th e device is to be inst alled. oil or chemicals may cause the package to melt or crack. ? the device should be mounted on an unwarped surface. ? do not apply stress to the resin at high temperature. ? the resin part is easily scratched, so avoid friction with hard materials. ? when installing the assembly board in equipment, ensure that this product does not come into contact with other components. ? conversion efficiency falls over ti me due to the current which flows in the infrared led. when designing a circuit, take into account this change in conversion efficiency over time. the ratio of fluctuation in conversion efficiency to fluctuation in infrared led optical output is 1:1. moisture-proof packing ? to avoid moisture absorption, the reel is packed in an aluminum bag that contains a desiccant with a humidity indicator. since the optical ch aracteristics of the photointerrputer may be affected during soldering by vaporization of the moisture whic h is absorbed in storable period, it sh ould be stored under the following conditions: 1. if the aluminum bag has been stored unopened temperature: 5 to 30 c relative humidity: 90% rh (max) time: 12 months 2. if the aluminum bag has been opened temperature: 5 to 30 c relative humidity: 70% rh (max) time: 168 h 3. baking should be conducted within 72 h after the humidity indicator shows > 30% or the bag seal date is over 12 months. the number of baking should be on ce. if the baking is conducted repeatedly, it may affect the peel-back force and cause a problem for mounting. baking condition: 60 5 c, 12 to 24 h storage period: 12 months from the seal date on the label 4. when the photointerrupter is baked, pr otect it from electrostatic discharge. 5. do not toss or drop to avoid damaging the moisture-proof bag. i c /i f (t) i c /i f (0) = p o (t) p o (0)
TLP848 2007-10-01 5 mounting methods 1. the example of temperature profile (reflow soldering) ? the first reflow process should be performed under the above temperature profile within 168 h after opening the bag. ? if a second reflow process needs to be performed, it should be performed within 168 h of the first reflow under the above temperature profile. ? storage conditions before the second reflow process: 30 c, 70% rh (max) ? do not perform wave soldering and manu al soldering with a soldering iron. 2. recommended soldering pattern unit: mm 3. cleaning when cleaning is required after soldering, toshiba recommends the following cleaning solvents. it is confirmed that these solvents have no effe ct on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean trough 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) toshiba technocare : (made by ge toshiba silicones) (frw-17, frw-1, frv-100) 0.575 1.075 1.0 1.5 30 50 s time (s) 60120 s package surface temperature (c) 250c max (*) 230c 180c 160c 10 s max (*) 4 c/s max (*) 4 c/s max (*) ( * ) the product is evaluated using above reflow solder ing conditions. no additional test is performed exceed the condition (i.e. the condition mo re than max values) as an evaluation. please p erform reflow solderin g under the above conditions.
TLP848 2007-10-01 6 packing specification 1. tape dimensions 1.750.1 1.5 + 0.1 ? 0 4.00.1 2.00.05 4.00.1 1.10.1 3.50.05 (2.75) 8.00.2 a a' a a' b b' b b' max 5 2.10.1 max 5 0.30.05 2.70.1 3.10.1 max 5 max 5 unit: mm device direction
TLP848 2007-10-01 7 2. reel dimensions 3. leader and trailer sections of tape 2 0.5 13 0.5 21 0.8 11.4 1 9 0.3 60 180 +0 ?4 unit: mm (note 1) 100 mm or more leading part: 400 mm or more 160 mm or more (note 2) note1: empty trailer section note2: empty leader section
TLP848 2007-10-01 8 4. packing format (1) packing quantity reel 1,500 pcs carton 7,500 pcs (2) packing form each reel is sealed in an aluminum bag that contains a desiccant with a humidity indicator.
TLP848 2007-10-01 9 0.01 0.1 1 10 1 10 100 1 10 100 1 10 100 1 10 100 0.9 1 1.1 1.2 1.3 1.4 1.5 0 0.5 1 1.5 2 2.5 3 3.5 4 024681012 0 20 40 60 80 0 20406080100 0 5 10 15 20 25 30 35 0 20406080100 i f ? ta ambient temperature ta (c) allowable forward current i f (ma) i f ? v f (typ. ) forward voltage v f (v) forward current i f (ma) 0 ta = 75c 50 25 ? 25 i c ? i f forward current i f (ma) collector current i c (ma) ta = 25 c v ce = 2v v ce = 0.4v sample 1 sample 2 i c / i f ? i f forward current i f (ma) current transfer ratio i c /i f (%) ta = 25 c v ce = 2v v ce = 0.4v sample 2 sample 1 i c ? v ce (typ.) collector-emitter voltage v ce (v) collector current i c (ma) 20 i f = 5ma 10 15 ta = 25c p c ? ta ambient temperature ta (c) allowable collector power dissipation p c (mw)
TLP848 2007-10-01 10 1 10 100 1000 110100 0.00 0.04 0.08 0.12 0.16 0.20 -40 -20 0 20 40 60 80 100 0.1 1 10 100 1000 0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 0.2 0.4 0.6 0.8 1 1.2 -40 -20 0 20 40 60 80 100 relative i c ? ta (typ.) ambient temperature ta (c) relative collector current v ce = 2v i f = 20ma i f = 10ma i f = 5ma v ce (sat) ? ta (typ.) ambient temperature ta (c) collector-emitter saturation voltage v ce(sat) (v) i c = 0.15ma i f = 10ma switching characteristics (saturated operation) (typ.) load resistance r l (k ) switching time ( s) ta = 25 c i f = 20ma v cc = 5v v out R 4.65v t r t s t f t d switching characteristics (non saturated operation) (typ.) load resistance r l (k ) switching time ( s) t r, t f t d t s ta = 25 c v cc = 5v v out = 1v i d (i ceo ) ? ta (typ.) ambient temperature ta (c) dark current i d (i ceo ) ( a) v ce = 12v
TLP848 2007-10-01 11 relative positioning of shutter and device for normal operation, position the shutter and the devi ce as shown in the figure below. by considering the device's detection direction characteristic and switching time, determine the shutter slit width and pitch. 0 0.2 0.4 0.6 0.8 1 1.2 -2 -1 0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 1.2 -1.2 -0.8 -0.4 0 0.4 0.8 1.2 detection position characteristics (1) (typ.) distance d (mm) relative collector current detection position characteristics (2) (typ.) distance d (mm) relative collector current i f = 5ma v ce = 2v ta = 25 c detection position d = 0 0.2mm 0 d shutter + ? i f = 5ma v ce = 2v ta = 25 c detection position d = 0.75 mm shutter d +0.6 - 0.5 1.35 min 0.75 0.25 max center of sensor unit: mm cross section between a and a' a a ? shutte r
TLP848 2007-10-01 12 restrictions on product use 20070701-en ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshib a products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. unintended usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implic ation or otherwise under any patents or other rights of toshiba or the third parties. ? gaas(gallium arsenide) is used in this product. the dus t or vapor is harmful to the human body. do not break, cut, crush or dissolve chemically. ? please contact your sales representative for product- by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.

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